Agilent 5953-4435 The Handling and Bonding of Beam Lead Devices Made Easy - Application Note c20131209 [7] free download

File name 5953-4435 The Handling and Bonding of Beam Lead Devices Made Easy - Application Note c20131209 [7].p

The Handling and Bonding of Beam Lead Devices Made Easy Application Note Introduction 710 (28) 670 (27) Beam lead devices are particularly suited for hybrid integrated 225 (9) 225 (9) 225 (9) 250 (10) circuits where low parasitics and small size are prime 200 (8) 200 (8) 200 (8) 175 (7) requirements. Available as single units or monolithic quads, the beam lead devices have made high packing density and superior performance easily achievable in hybrid circuits. 130 (5) There are single beam lead devices in four different 100 (4) outlines--05 and 10 for Schottky diodes, 06 and 07 for PIN diodes. A picture of the HPND-4001 PIN diode in outline 07 appears in Figure 1. As typical of the single beam lead 12 (0.48) 8 (0.32) devices, this beam lead PIN diode consists of a silicon chip with coplanar plated gold tabs (beam leads measuring barely 5 mils wide and 0.5 mil thick) 9 mils beyond the edge. The detailed dimensions of outline 07 shown in figure 2 illustrate the small size of the beam lead package, which results in Dimensions in